Design-Reuse

M31 Deploys a Full Range of IP for TSMC 16nm FFC Process

Hsinchu, Taiwan, Mar. 08, 2017 – H.P. Lin, Chairman of M31 Technology today announced that it deploys a full range of silicon IP in TSMC's 16nm FFC (FinFET Compact) process technology. With TSMC's ...
Design-Reuse

eMemory Announces Industry's First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP

Hsinchu, Taiwan, Mar. 14, 2016 – eMemory announces today that its OTP technology NeoFuse has been verified in 16nm FinFET Compact process (16FFC), marking an important milestone as the world's first ...
Sudan Tribune

Opposition FFC calls to consider Sudan’s dialogue a step towards inclusive process

May 21, 2016 (KHARTOUM) – Sudan’s opposition alliance of the Future Forces of Change (FFC) has expressed optimism that it could reach an agreement with the national dialogue mechanism known as “7+7” ...
Electronic Design

ZIF Connector Boosts FFC/FPC Retention Force

Targeting applications that use flexible printed circuit (FPC) or flexible flat cable (FFC), Hirose Electric developed a halogen-free, 0.5-mm-pitch, zero-force-insertion (ZIF) connector. The FH52’s ...